August 13, 2026 07:15 pm (IST)
Follow us:
facebook-white sharing button
twitter-white sharing button
instagram-white sharing button
youtube-white sharing button
Netaji row: Suvendu Adhikari govt strips BJP MP Anant Maharaj of state honour | Sukhbir Badal attacked by Nihang Sikh with kirpan at Maharashtra gurdwara; assailant detained | ‘If you cannot do it, we will pass an order’: Supreme Court’s final warning to Centre on food labels | ‘Time to move on’: Bombay HC sends strong message in Vijay Mallya-bank dispute | Netaji row explodes in Bengal: Suvendu Adhikari orders police action over ‘derogatory’ posts | Kolkata's NRS Hospital nurse found dead in washroom during night shift | RG Kar rape-murder case takes fresh turn as ex-TMC MLA Nirmal Ghosh arrested over cremation probe | ‘Govt has nothing to hide’: Amit Shah says ‘ready for debate’ on NEET crackdown; Rahul Gandhi hits back, ‘not interested in lecture’ | Tata Sons leadership shock: N Chandrasekaran won’t seek reappointment as chairman after February 2027 | ISI-linked Pakistani national arrested in Bengal over 'espionage' targeting Army, BSF, Railways
Odisha
Advanced 3D Glass Semiconductor Packaging Unit to be unveiled in Odisha. Photo: Unsplash

Game changer: India’s first Advanced 3D Glass Semiconductor Packaging Unit to be unveiled in Odisha

| @indiablooms | Apr 18, 2026, at 03:35 pm

Odisha is set to take a major leap toward becoming a global hub for advanced semiconductor manufacturing, with the groundbreaking ceremony of India’s first Advanced 3D Glass Semiconductor Packaging Unit scheduled for April 19, 2026, in Bhubaneswar.

The ceremony will be attended by Chief Minister Mohan Charan Majhi and Union Minister for Electronics and IT Ashwini Vaishnaw. Global industry leaders, including Lip-Bu Tan, are expected to participate virtually.

The project, led by 3D Glass Solutions, marks the introduction of cutting-edge 3D chip packaging technology in India, positioning Odisha at the forefront of next-generation semiconductor innovation.

With an estimated investment of ₹1,943 crore, the facility will have an annual production capacity of 50 million assembled units and is expected to generate around 2,500 direct and indirect jobs.

The unit is backed by major global technology players, including Intel, Lockheed Martin, and Applied Materials. The chips produced will cater to critical sectors such as aerospace, defence, artificial intelligence, and 5G technologies.

Officials noted that the project reached the groundbreaking stage within months of receiving Union Cabinet approval, underscoring its fast-track implementation.

With this development, Odisha becomes the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D glass chip packaging facility, strengthening its semiconductor ecosystem.

The initiative highlights the state government’s push to attract global investments, foster high-tech industries, and build an innovation-driven economy aligned with the vision of Atmanirbhar Bharat.

Support Our Journalism

We cannot do without you.. your contribution supports unbiased journalism

IBNS is not driven by any ism- not wokeism, not racism, not skewed secularism, not hyper right-wing or left liberal ideals, nor by any hardline religious beliefs or hyper nationalism. We want to serve you good old objective news, as they are. We do not judge or preach. We let people decide for themselves. We only try to present factual and well-sourced news.

Support objective journalism for a small contribution.